AMD has released a dual-slot version of their high-end Radeon Pro W7900 card, designed to improve compute density in workstations by allowing four cards to be installed in a single chassis.
Source: https://www.anandtech.com/
Technology | Rating: 89 | 2024-06-03 03:06:20 AM |
AMD CEO Dr. Lisa Su announced plans to release a new AI accelerator, the Instinct MI325X, in Q4'24. The company is focusing on the growth of their Instinct lineup, with the MI300 breaking sales projections and growth records quarter after quarter.
Source: https://www.anandtech.com/
Technology | Rating: 92 | 2024-06-03 03:06:06 AM |
AMD CEO Dr. Lisa Su announced the Ryzen AI 300 series, a new chip lineup for the mobile market, based on the Zen 5 CPU microarchitecture. The Ryzen AI 300 series, codenamed Strix Point, aims to offer improved performance in mobile SoC and the fastest AI inference performance in the compact and portable PC market.
Source: https://www.anandtech.com/
Technology | Rating: 94 | 2024-06-03 03:05:54 AM |
Source: https://www.anandtech.com/
Duplicated with: | 2024-06-03 03:05:05 AM |
Source: https://www.anandtech.com/
Duplicated with: | 2024-06-03 01:25:04 AM |
Computex 2024 is set to kick off in Taipei, featuring a packed show with local Taiwanese firms like Asus, MSI, and ASRock, as well as major chip developers increasing their presence. The event is expected to focus on PC technology advancements.
Source: https://www.anandtech.com/
Technology | Rating: 83 | 2024-06-01 12:25:19 AM |
Taiwan Semiconductor Manufacturing Company (TSMC) outlined a roadmap for its 3D-stacked system-on-integrated chips (SoIC) packaging technology, aiming to reduce the bump pitch from 9μm to 3μm by 2027, stacking A16 and N2 dies. The technology will evolve rapidly, with current 2.5D CoWoS and 2.5D/3D InFO methods also being developed.
Source: https://www.anandtech.com/
Technology | Rating: 92 | 2024-05-31 03:05:19 PM |
GEEKOM, a private label brand of Shenzhen Jiteng Network Technology Co., has introduced ultra-compact form-factor (UCFF) systems with regular 45W TDP processors in cTDP-down mode. This marks a shift from the initial 6-15W TDP processors used in the early years of UCFF systems.
Source: https://www.anandtech.com/
Technology | Rating: 74 | 2024-05-31 12:05:04 PM |
TSMC has confirmed that its 2nm process, featuring gate-all-around transistors, has achieved its target performance and yield goals, paving the way for high-volume manufacturing in the second half of 2025.
Source: https://www.anandtech.com/
Technology | Rating: 92 | 2024-05-30 07:05:20 PM |
Lexar, a leading flash-based storage company, has launched the ARMOR 700 Portable SSD, its new flagship product in the 20 Gbps PSSD segment. The ARMOR 700 offers high-speed performance and is designed for consumers seeking reliable and portable storage solutions.
Source: https://www.anandtech.com/
Technology | Rating: 64 | 2024-05-30 12:05:05 PM |
