Arm introduces Cortex X925 and enhances its Armv9.2 architecture with Client Compute Solutions (CSS) for 2024, focusing on mobile innovation and cutting-edge solutions for end-users.
Source: https://www.anandtech.com/
Technology | Rating: 92 | 2024-05-29 03:05:37 PM |
Rapidus, a Japanese foundry startup, plans to expand its services to include chip packaging in 2027. The company, backed by the Japanese government and major Japanese companies, will enter the competitive contract chipmaking market, driven by demand for leading-edge process technologies in AI and HPC applications.
Source: https://www.anandtech.com/
Technology | Rating: 92 | 2024-05-24 08:05:23 PM |
MSI has published the first image of its new Z790 Project Zero Plus motherboard, which supports DDR5 compression attached memory module (CAMM2) technology. CAMM2 improves upon SO-DIMM form factors, alleviating limitations and reducing volume requirements.
Source: https://www.anandtech.com/
Technology | Duplicated with: | Rating: 87 | 2024-05-24 12:06:01 PM |
ASUS and ASRock have launched NUCs (Next Unit of Computing) featuring Intel's Meteor Lake processors. This marks the introduction of Meteor Lake in the consumer market, following its reveal in September 2023. The focus is on mobile devices, but Intel and its partners are also exploring other applications.
Source: https://www.anandtech.com/
Technology | Rating: 92 | 2024-05-23 12:05:20 PM |
Taiwan Semiconductor Manufacturing Company (TSMC) will start high-volume manufacturing on its N3P process later this year and introduce two competing process technologies, N3X and N2P, in the second half of 2025, with advertised performance-per-area (PPA) improvements.
Source: https://www.anandtech.com/
Technology | Rating: 92 | 2024-05-22 09:35:23 PM |
TSMC revealed details about its Global Gigafab Manufacturing program at its European Technology Symposium, aiming to replicate manufacturing processes across multiple gigafab sites, addressing the need for large-scale multi-national fabs to scale-up and scale-out manufacturing processes.
Source: https://www.anandtech.com/
Technology | Rating: 89 | 2024-05-22 07:05:20 PM |
Taiwan Semiconductor Manufacturing Company (TSMC) plans to increase its chip-on-wafer-on-substrate (CoWoS) capacity by 60% annually to meet growing demand for AI and HPC processors. The company aims to more than double its CoWoS capacity by the end of 2024, driven by customer demand for advanced packaging technologies.
Source: https://www.anandtech.com/
Technology | Rating: 92 | 2024-05-21 03:34:08 PM |
Source: https://www.anandtech.com/
2024-05-21 01:05:21 PM |
Lenovo announces two new notebooks, Yoga Slim 7x Gen 14 and ThinkPad T14s Gen 6, featuring Qualcomm's Snapdragon X Elite processor, targeting content creators and business professionals. The devices run on Windows on Arm platform, marking a new era for Microsoft's platform.
Source: https://www.anandtech.com/
Technology | Rating: 82 | 2024-05-20 06:06:00 PM |
