Rapidus, a company, plans to offer fully automated packaging for its 2nm-class process technology in 2027. The company's president, Atsuyoshi Koike, believes this will be a competitive edge, allowing for shorter chip lead times. The new fab, located in Hokkaido, is currently under construction and is expected to begin equipment installation in December.

Source: https://www.anandtech.com/

Kioxia demonstrated a proof-of-concept of a new RAID offload methodology for enterprise SSDs at FMS 2024. The method uses PCIe direct memory access and the SSD controller's controller memory buffer to avoid data traveling back to the CPU and main memory. This aims to solve the problem of maintaining performance in RAID arrays as SSDs get faster.

Source: https://www.anandtech.com/

Western Digital has introduced 4 TB microSDUC and 8 TB SD cards using their BiCS8 218-layer 3D NAND technology. The cards are rated for UHS-I speeds and are being marketed for use in various client and enterprise platforms. The company also showcased two 16 TB portable SSDs, one with external power and the other in the SanDisk Extreme Pro housing.

Source: https://www.anandtech.com/

Noctua is a well-known brand in the PC building community for their high-performance coolers, offering exceptional build quality and superb cooling performance. Their products, such as the NH-D15 G2 LBC Cooler, are popular among enthusiasts who need a more advanced cooler to meet their needs.

Source: https://www.anandtech.com/

Kioxia showcased its BiCS 8 NAND technology at FMS 2024, featuring 216 layers. The company, along with Western Digital, had announced the sampling of BiCS 8 in March 2023. The technology uses a CMOS Bonded Array (CBA) scheme, which involves placing the CMOS under the cell array, improving the wafer development process.

Source: https://www.anandtech.com/

Intel has published its first microcode update, version 0x129, to address the elevated voltage issue causing Raptor Lake processor degradation. The issue, identified as an 'elevated operating voltage' problem, affects high-TDP desktop Raptor Lake processors from the 13th and 14th generations.

Source: https://www.anandtech.com/

Phison introduced the E29T Gen 4 controller, a low-cost DRAM-less solution for mainstream applications, at FMS 2024. The controller is designed to eke out performance on the Gen 4 platform. Phison has already showcased other solutions, including the E31T Gen 5 mainstream controller and a USB4 native flash controller for high-end PSSDs.

Source: https://www.anandtech.com/

The US government has signed memorandums of understanding worth $1.5 billion with Amkor and SK hynix to support their efforts to build chip packaging facilities in the US. Amkor plans to build a $2 billion advanced packaging facility, with Apple in mind. The US government aims to expand the country's semiconductor production industry, with Intel, Samsung, and TSMC receiving tens of billions of dollars in grants and loans.

Source: https://www.anandtech.com/

Intel has postponed its Innovation 2024 event, previously scheduled for September 2024, to 2025. The company is looking to streamline its business operations and cut costs into 2025. Innovation is Intel's technical showcase for developers, customers, and the public, and is the successor to the company's legendary IDF show.

Source: https://www.anandtech.com/

Microchip has announced the availability of its second PCIe Gen 5 enterprise SSD controller, the Flashtec 5016. The controller features 16 channels, supports PCIe 5.0 lane organization, and operates in x4 or dual independent x2/x2 mode. It also supports four ranks of DDR5-5200 and 3200 MT/s NAND, and is capable of delivering 3.5M+ random read IOPS.

Source: https://www.anandtech.com/