亿道信息，作为国内加固计算机产业领先企业，正在利用AI为产业注入创新。从硬件到应用，亿道信息正在推进AI加固终端的规模化落地，以支撑各行业的AI化转型和智能化未来。刘远贵，亿道信息总经理，是一名从事电气工程及其自动化的高层次人才，曾在华东计算技术研究所工作，并在深圳亿道控股有限公司和深圳亿道信息股份有限公司任职。
Source: https://tech.163.com/smart/
AI亿道信息 | Duplicated with: | Rating: 52 | 2024-12-25 01:39:09 AM |
当前为有一个安全给编程常子的车频常子。常子当前安全给编程常子为当前给编程常子的粗于分粗。常子当前给编程常子为常子粗于分粗的粗于分粗。
Source: https://tech.163.com/smart/
AI | Rating: 13 | 2024-12-25 01:19:14 AM |
Based on a report from phonearena, the semiconductor industry will face intense competition in 2025 as companies begin mass production of 2nm process chips and lower the production cost of 3nm process chips. TSMC, the world's largest semiconductor foundry, will use its second-generation 3nm process (N3E) in Apple's iPhone 16 and iPhone 16 Pro's A18 and A18 Pro processors. Despite rumors that TSMC will use the 2nm process to produce the A19 series processor, it is said that the iPhone 17 series phones in 2026 will still use TSMC's third-generation 3nm process (N3P) chips. To save costs, Apple plans to first apply the 2nm process in the A20 and A20 Pro processors of the iPhone 18 series in 2026. TSMC has already attracted many customers for its 2nm production plan, including Apple and many other manufacturers' HPC and AI chip orders, making it the leader in 2nm process orders over Intel and Samsung foundries. In contrast, Samsung has faced challenges in the yield rate of 4nm, 3nm, and 2nm processes in recent years. Samsung's 3nm Exynos 2500 processor yield rate is still poor, forcing Samsung to equip the Galaxy S25 series phones with the more expensive Snapdragon 8 Gen 1 Supreme Edition processor instead of using its own Exynos 2500 chip. In addition to TSMC and Samsung, Rapidus, a potential competitor in the semiconductor foundry industry in 2023, is a Japanese company funded by the Japanese government and collaborating with the US, using IBM technology to produce 2nm chips. However, specific technical details of this company are not yet known.
Source: https://tech.163.com/smart/
TechnologyTSMC | Rating: 52 | 2024-12-24 11:59:20 PM |
MIT 工程师开发了一种无需硅晶圆基底的多层芯片制造技术，可在任意晶体表面直接制造高性能半导体元件，提高层间通信和整体计算速度。这项技术预计将在 AI 硬件领域带来突破，使芯片堆叠不再受传统限制，提升 AI 计算、逻辑运算和存储设备的性能。
Source: https://tech.163.com/smart/
AIMIT | Rating: 62 | 2024-12-24 11:28:56 AM |
联发科推出天玑8400芯片，采用4nm工艺，集成8个主频最高达3.25GHz的Arm Cortex-A725大核，支持144Hz WQHD+显示和折叠双屏设备，提供高速生成式AI任务处理能力。
Source: https://tech.163.com/smart/
AI联发科 | Rating: 60 | 2024-12-24 09:19:10 AM |
宇树机器狗的技能点拉满，贝克汉姆与超级巨星合作
Source: https://tech.163.com/smart/
AI宇树机器狗 | Rating: 51 | 2024-12-24 08:49:21 AM |
郭明錤预计苹果标准 M5 芯片将在 2025 年上半年量产，随后是 M5 Pro 和 M5 Max 芯片，M5 Ultra 芯片将在 2026 年量产。
Source: https://tech.163.com/smart/
TechnologyApple | Duplicated with: | Rating: 62 | 2024-12-24 08:19:05 AM |
MemryX 推出了 MX3 M.2 AI 加速模块，售价 149 美元，算力为 24 TOPS。该模块采用标准 M.2 2280 尺寸，功耗低，支持多种数据格式和 AI 框架。
Source: https://tech.163.com/smart/
AIMemryX | Rating: 62 | 2024-12-24 03:09:19 AM |
