MediaTek has announced the Dimensity 8400, a premium smartphone chip with an All Big Core design, offering powerful Gen-AI performance and 41% higher multi-core performance compared to its predecessor.

Source: https://corp.mediatek.com/news-events/press-releases

MediaTek, an industry leader in ASIC, will demonstrate its silicon proven long reach 224G SerDes at the OCP Global Summit in San Jose, California. The 224G SerDes is a significant leap forward in performance, reliability, and efficiency for high-performance ASIC applications. The company's portfolio includes 56G and 112G ASIC, Retimers, and AEC solutions.

Source: https://corp.mediatek.com/news-events/press-releases

Source: https://corp.mediatek.com/news-events/press-releases

MediaTek will integrate NVIDIA TAO with its NeuroPilot SDK, enabling developers to bring edge AI capabilities to various IoT applications. MediaTek will support NVIDIA TAO at COMPUTEX 2024. The company's edge silicon portfolio is designed to maximize edge AI performance and efficiency.

Source: https://corp.mediatek.com/news-events/press-releases

MediaTek has joined Arm Total Design to accelerate and simplify the development of products based on Arm Neoverse Compute Subsystems, designed for AI applications in data centers, infrastructure systems, and telecommunications. The partnership aims to enable customers' designs to meet challenging workloads for AI applications, maximizing performance per watt. MediaTek's expertise in hybrid computing, AI, SerDes, and chiplets will be utilized to advance the development of data center products.

Source: https://corp.mediatek.com/news-events/press-releases

MediaTek will showcase new products and technology demos at COMPUTEX 2024, featuring highlights in AI, Smart TVs, Chromebooks, and IoT. The company will debut two new chipsets, including the Kompanio 838 SoC for premium Chromebooks, and a keynote by Vice Chairman and CEO Dr. Rick Tsai on ubiquitous AI.

Source: https://corp.mediatek.com/news-events/press-releases

MediaTek announced the Dimensity 7300 and 7300X, 4nm chipsets for high-tech mobile devices. The Dimensity 7300 offers best-in-class power efficiency and performance for multitasking, photography, gaming, and AI-enhanced computing. The Dimensity 7300X is designed for flip-style foldable devices with dual displays.

Source: https://corp.mediatek.com/news-events/press-releases

Source: https://corp.mediatek.com/news-events/press-releases

Source: https://corp.mediatek.com/news-events/press-releases

Source: https://corp.mediatek.com/news-events/press-releases